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Derniers dépôts
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Simon Chouteau, L. Stafford, Agnès Granier, Antoine Goullet, Mireille Richard-Plouet. Handling Nanoparticle Content in Nanocomposite Thin Films Deposited by Misty Plasma Processes through Controlled Flash Boiling Atomization. Langmuir, 2024, 40 (6), pp.3015-3023. ⟨10.1021/acs.langmuir.3c03176⟩. ⟨hal-04549282⟩
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Issraa Shahine, Quentin Hatte, Maxime Harnois, Pierre-Yves Tessier. Large Area Freestanding Au Nanoporous Ultrathin Films Transfer Printed on Bendable Substrates and 3D Surfaces for Flexible Electronics. ACS Applied Electronic Materials, 2024, 6 (4), pp.2281-2288. ⟨10.1021/acsaelm.3c01771⟩. ⟨hal-04552765⟩
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Pascal Bargiela, Vincent Fernandez, Christophe Cardinaud, John Walton, Mark Greiner, et al.. Towards a reliable assessment of charging effects during surface analysis: Accurate spectral shapes of ZrO2 and Pd/ZrO2 via X-ray Photoelectron Spectroscopy. Applied Surface Science, 2021, 566, pp.150728. ⟨10.1016/j.apsusc.2021.150728⟩. ⟨hal-03355769⟩
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Allan Lebreton, Marie-Paule Besland, Pierre-Yves Jouan, Tatiana Signe, Cédric Mannequin, et al.. Control of microstructure and composition of reactively sputtered vanadium nitride thin films based on hysteresis curves and application to microsupercapacitors. Journal of Vacuum Science & Technology A, 2024, 42 (2), pp.023405. ⟨10.1116/5.0177028⟩. ⟨hal-04423908⟩
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Michael Rodriguez-Fano, Mohamad Haydoura, Julien Tranchant, Etienne Janod, Benoît Corraze, et al.. Enhancing the Resistive Memory Window through Band Gap Tuning in Solid Solution (Cr1–xVx)2O3. ACS Applied Materials & Interfaces, 2023, 15 (47), pp.54611-54621. ⟨10.1021/acsami.3c09387⟩. ⟨hal-04361024⟩
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J. Zgheib, L. Berthelot, J. Tranchant, N. Ginot, M.-P. Besland, et al.. Electron-enhanced high power impulse magnetron sputtering with a multilevel high power supply: Application to Ar/Cr plasma discharge. Journal of Vacuum Science & Technology A, 2023, 41 (6), pp.063003. ⟨10.1116/6.0002857⟩. ⟨hal-04299303⟩
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T Meyer, A Girard, M Bouška, E Baudet, M Baillieul, et al.. Mass spectrometry and in situ x-ray photoelectron spectroscopy investigations of organometallic species induced by the etching of germanium, antimony and selenium in a methane-based plasma. Plasma Sources Science and Technology, 2023, 32 (8), pp.085003. ⟨10.1088/1361-6595/aceaa5⟩. ⟨hal-04186877⟩
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Anthony Valero, Adrien Mery, Dorian Gaboriau, Marc Dietrich, Maggie Fox, et al.. Redefining high-k dielectric materials vision at nanoscale for energy storage: A new electrochemically active protection barrier. Electrochimica Acta, 2021, 389, pp.138727. ⟨10.1016/j.electacta.2021.138727⟩. ⟨hal-03355843⟩
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Rémi Dussart, Thomas Tillocher, Gaelle Antoun, Jack Nos, Philippe Lefaucheux, et al.. Plasma cryogenic etching processes: what are the mechanisms involved at very low temperature ?. 14th EU-Japan Joint Symposium on Plasma Processing (JSPP) 2023, Satoshi Hamaguchi, Apr 2023, Okinawa, Japan, Japan. ⟨hal-04072312⟩
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Nombre de documents
77
Nombre de notices
277
Mots-clés
XPS
Films
Sputtering
Spectroscopic ellipsometry
Cathepsin
CIGSe
Anatase
Carbon nanotubes
A1 Characterization
Transfert d'énergie
Avalanche breakdown
Applications industrielles
Sol-gel
Atomic force microscopy
Vanadium Sesquioxide
Band alignment
A3 Physical vapor deposition processes
Titanium dioxide
B1 Inorganic compounds
CNTs’ collapse
Amyloid precursor
AZO thin films
Magnetron sputtering
Selenization
SF 6
C Photoelectron spectroscopy
X-ray diffraction
Mott insulator
B Chemical synthesis
A Chalcogenides
TEM
B2 Quaternary
Bixbyite
Chalcogenide
PECVD
Biofilms microbiens
X-ray photoelectron spectroscopy
Non-volatile memory
Chalcogenide glass
Oxides
Adsorption
Physical vapor deposition
Aluminium nitride
Semiconductors
B3 Solar cells
Chemical and biological sensors
Aryl-diazonium salts
Mott insulators
Resistive switching
Buffer Couple
Structure
Alzheimer's disease
AlN
Low-pressure plasma processing
Amorphous
Argon InP chlorine etching inductive coupled plasma ICP modeling plasma sheath simulation
Optical properties
Calcined clay
Ambipolar material
Carbon nitride
CHLORINE PLASMAS
3 nm in size
Ablation laser
Band gap
A-CNx
Thin films
AuCu alloy
Biomasse
Chemical detection
Capacitance
Plasma etching
BOMBARDMENT
NEXAFS
CaTiO3Pr^3^+
A Multilayers
Nanotubes
Thin film
Colloidal solution
Alloying
A Thin films
Residual stress
B2 Semiconducting alloys
Biocapteurs
Carbon Nanotube
Kirkendall effect
Nanocomposite
Plasmas froids
Bipolar resistive switching BRS
Scanning electron microscopy
V2O3
Chalcogenides
Carbon
TiO2
CH4
Transmission electron microscopy
Atomic layer etching
Copper
Functionalization
B2 Semiconducting indium compounds
Etching